ALCHEMY 'D' TYPE HORIZONTAL HOT AIR LEVELING SYSTEM:
SUITABLE FOR CONVERSION TO LEAD FREE SOLDER
(Straight format. Up to estimated 300 panels per hour)
The information contained in the following pages describes the Alchemy ‘D’ horizontal hot air leveling system manufactured by Circuit Engineering Marketing Co. Ltd, usually known as Cemco..
Cemco has been designing and manufacturing high quality equipment for the Printed Circuit Board Industry for over 25 years. Products include wet processing and panel handling systems, registration equipment and laboratory test machines.
However, Cemco is best recognised for equipment associated with solder coating. Many roller-tinning systems were supplied to companies in Europe through the 1970's, and then in 1983 the 'Quicksilver' vertical hot air leveler was launched.
This machine, which incorporated many innovative ideas, has become the most successful vertical leveler ever built. More than 650 Quicksilver machines are in operation around the world, and it is widely recognised as being the very best for quality, reliability and durability.
Alchemy horizontal leveling systems continue this tradition. The result of an extended research and development programme, and substantial investment, Alchemy now leads the field in selective solder coating technology.
The benefits from operating an 'Alchemy' system can be significant. Yields of up to 99.8% (first pass yield approx. 97%), new levels of quality and consistency, less maintenance time and materials usage, and the cost of consumables (flux, oil and solder) reduced by 50% to 70%.
The key advantages of the 'Alchemy' horizontal leveling system can be summed up in the word 'control':
Cost control, Process control, and Quality control.Typical XRF measurements:
20-25 mil SMT lands: mean - 7.5 u, UCL - 12.5 u, LCL - 2.5 u
20 mil BGA lands: mean - 10 u, UCL - 13.75 u, LCL - 6.25 u,
From the menu-driven touch screen display, process parameters can be changed, stored and re-called to process new and repeat products. Since all process data can be down loaded to a PC, its use is limited only by the imagination.
Conventional applications include production and quality control, cost analysis, and maintenance scheduling. Via a modem, more creative applications can include everything from on-line supplier support to centralised process engineering of similar equipment at remote sites.
Note: The above references relate to panels processed with SnPb.Experience indicates that lead free processing is capable of producing thicker minimum deposits and a tighter minimum /maximum variance.
OVERVIEW
The 'D type' has been designed specifically with low to medium capacity facilities in mind. However, it is an ideal option for existing Alchemy or other Leveler users where additional capacity for high quality product is required, and where floor space is limited. While the solder coater is compatible with lead free alloy alternatives to 63Sn 37Pb, Cemco recommend testing your product to determine capability.
The system incorporates a panel align/rotator, allowing the system to be installed in a straight line. Cemco manufactures the ‘Core system’ comprising pre-heating through to cooling, while the pre and post treatment lines are manufactured by FSL (part of the Cemco group of companies).
The attached description contains information on a fully automated horizontal hot air leveling system, incorporating panel load, chemical clean & rinse, dry, pre-heat, hot air level, cool, flux removal, dry, and unload.
The System Description should be read in conjunction with the accompanying Performance Specification, and Drawing No. LA 0586 issue A.
The pre and post treatment sections have a conveyor width of 69 cm (27"), whereas the hot air leveling module has a conveyor width of 84 cm (33") to accommodate panels being processed diagonally.
The system described is capable of processing up to estimated 300* panels per hour.
* The overall capacity of the system is dependent on the mass of the panel, preferred pre-clean chemistry and final washing requirement (SIR's). Using Persulphate @ approx. 175 grams per litre (refer to chemical supplier) the Chemical Clean section is designed to remove typically 0.5-0.6 microns (20-24 micro inches). Throughput figures are based on panel dimensions of 460 mm x 610 mm x 1.6mm (18" x 24" x .062"). Thicker product will process more slowly unless additional pre-heat modules are incorporated into the line.
Loading, unloading and panel handling will also be dependent on the user's requirements, available space, etc.
The Alchemy 'D' leveling module incorporates a panel align/rotate module, flux applicator, solder coating and air leveling unit, and an air support exit table.
Pre-cleaned and pre-heated panels enter the unit via the align/rotate module which automatically rotates the panel to 45o (panels larger than 46cm x 61 cm (18" x 24") are processed at a proportionally reduced angle). Once panels have been solder coated, they enter the cleaning system via a re-alignment-cooling table.
All adjustments are made via Siemens/Allen-Bradley touch screens, connected to Allen-Bradley PLC's. The system is designed to operate asynchronously, allowing each process element to be set to suit the panel design and solder thickness specification. Adjustment for panel size is automatic.
System specification for Drawing No. LA 0586 issue A.
The following describes an example configuration for an Alchemy 'D' system scaled to operate at up to estimated 300 panels per hour, based on 0.062" thick product (dependent on weight and layer count) .
The System comprises 6 interactive sections:-
SECTION 1 PRE-TREATMENT (Drawing Ref. 1-6&18)
NOTE: The pre-clean conveyor speed is adjustable via the touch screen (Drawing Ref.17), commensurate with required etch rate. Nominal conveyor speed is 3.50 metres (11.5 ft.) per minute. Nominal pre-clean temperature is 43o C. (110o F.). Pre-clean heat up time from ambient - approx. 1-2 hours. Mains water feed to final wash required at approx. 9.11-18.22 litres (2.0-4.0 imperial gallons) of reverse osmosis water per minute.
65 PANEL FLAT BELT FEEDER (OPTIONAL) (Drg Ref. 1)
A 65 panel fan-type feeder, with software controlled indexing providing one or two step index options to facilitate thin or bowed panels. Panel thickness capability - 0.40 mm to 3.18 mm nominal (0.016" to 0.125" nominal) depending on panel size and rigidity (minimum thickness will be greater for larger, less rigid panels). Panels are manually loaded with the narrowest dimension located in the slats. The mechanism indexes forward until a panel is placed onto the conveyor. Subsequent panels are fed onto the conveyor at a rate necessary to maintain a minimum spacing of 51 mm (2"), or at intervals commensurate with selected pre-heat/pre-clean speed or leveling speed.
FULL LENGTH INPUT CONVEYOR (Drg Ref. 2)
A PVC or Polypropylene tray, with drainage point, supporting a bed of driven rollers. A Panel Sensor is linked to solenoid valves on all water wash inlets for water conservation.
Length
: 915 mm (36")
Width
: 940 mm (37")
Conveyor Width : Nominal:
760 mm (30"), Effective: 635 mm (25")
Drainage Connection : Nominal 40 mm
CHEMICAL CLEANER MODULE Drg Ref. 3)
A general-purpose spray module comprising a holding sump and pump & spray manifolds suitable for use with chemicals compatible with Stainless steel components. The module is equipped with heating/cooling capability as required and is fitted with all the features found on the larger process modules used with the Alchemy C hot air leveling system.
Shell Construction
: PVC
Overall Machine Dimension Length
: 1,435mm (56”), Width: 1524mm (60”),
Height
: 1190mm (47”) 30mm (1.2”),
Effective length
: 1,016mm (40”)
Conveyor Width (mm)
: Nominal: 760mm (30”), Effective: 635mm (25”)
Main Process Pump
: 2.2 kW max. x 2
Heaters
: Max. total kW: 12
Cooling Hardware
: Via submerged coil.
Cooling System Connections
: 13mm (0.5”) entry and exit hoses
Cooling Water Supply Temperature
: Should not exceed 10C (50 F)
Temperature Control
: Within 2.8 deg C (5 deg F)
Sump Capacity
FOUR STAGE CASCADE WASH MODULE (1 X ACID RINSE; 3 X WATER WASH) (Drg Ref. 4)
A multi-stage washing section based on 4 chambers contained within one module. The first chamber is a re-circulating acid spray and the subsequent 3 recirculating water wash sections are fed with fresh water from the final chamber. Squeegee rollers between each chamber and at module entry and exit points ensure minimal solution losses.
Shell Construction
: PVC.
Overall Machine Dimensions : Length: 1169mm (46"),
Width: 1045mm (41")
Height
: 1190mm (47")
DRYER (Drawing Ref. 5)
An air knife unit designed to remove water from panel surfaces and holes. It incorporates patented angled airknives delivering a high velocity air-stream to the panel via a variable speed blower unit.
Shell Construction
: PVC
Overall Machine Dimensions (mm) : Length: 485, Width:
1,175, Nominal Height: 1,230
Conveyor Dimensions (mm)
: Nom. width: 760, Effective width: 635, Height: 920 - 980
Air Knives
: 1 upper, 1 lower Aerotip patented fluid airknives
Air Blower
: 5.6 kW variable speed
Heater
: N/A
Drain Connection
: 25 mm O/D
VERTICAL BUFFER (OPTIONAL) (Drg Ref. 6)
A vertical buffer offering the advantage of allowing incoming panels to be buffered in the event of a temporary shut-down of the Alchemy leveling section. The innovative reverse action conveyor drive will accommodate panels from the Pre-Treatment section before the buffer and the Pre-Heat section after the buffer, and will re-introduce them into the system once the leveling section is back in operation.
SECTION 2 LEVELING SECTION (Drawing Ref. 7-10, 17, 20, 22 & 24)
Because panels pass through the solder pot of a horizontal leveler at a continuous, relatively fast speed, there is insufficient time to absorb the required energy; therefore pre-heating is necessary. The pre-heating required to effect wetting is minimal, but in order to clear holes effectively (without the use of excessive air knife pressures which can result in exposed intermetallic coatings on surface features) the core temperature must be at or above 100o C. (212o F.).
The time/temperature profile required to achieve this is directly proportional to the thermal characteristics of the panel. A pre-heat system is normally 'sized' to suit the majority of product produced. The conveyer speed can be increased or decreased to suit thinner and thicker product.
Normally, three pre-heat modules is sufficient for up to 300 panels 1.6mm (.062") per hour but we recommend testing with 'typical' product to confirm productivity estimates. Conventionally, I.R. radiation is employed to pre-heat panels, but this produces excessive surface temperatures relative to core temperature. The high surface temperatures increase flux absorption into the epoxy resin of the laminate and the solder mask, requiring the use of solvents to meet SIR requirements.
Thick product may be darkened or damaged before the required core temperature is achieved. For these reasons the 'Alchemy' system employs forced convection pre-heaters which have the advantages of imparting more energy to the core of the panel than I.R., avoid over-heating of the surface, and eliminate the risk of ignition should a panel jam under the emitters.
PRE-HEAT UNIT (Drg Ref. 7, 20 & 24)
A continuous wire belt conveyor module, providing controllable pre-heating of panels prior to leveling. A re-circulated air flow system is employed incorporating partial fresh air input. A hinged top cover allows operator access to the conveyor system. Two 9kw heaters are fitted to each module to elevate the operating temperature to approximately 428 deg F (220 deg C) In the event of a system fault, the conveyor and hot air fan are isolated.
ALIGN/ROTATE INPUT SECTION (Drg Ref. 8)
The unit incorporates a software controlled independent drive PTFE wheel conveyor. Once the trailing edge of the panel is clear of the Pre-heat exit conveyor, the panel spacing is increased to accommodate the rotate cycle. An alignment mechanism positions the panel in the centre of the conveyor. A panel sensor tracks the leading and trailing edges of the panel, and when it’s mid-point is centrally over the rotate mechanism, the panel is elevated above the conveyor, rotated 45 degrees, and lowered onto the conveyor. While panels up to 457mm x 610mm (18" x 24") are rotated to 45 degrees, larger panels are rotated to the maximum permitted angle, restricted by a 788mm (31") working dimension across the conveyor.
As the panel enters the fluxing section a roller is lowered to provide positive drive into the flux application rollers and prevent any deviation in set angle.
FLUX & SOLDER COATING AND AIR LEVELING (Drg Ref. 9)
Comprising:-
1. Flux coating module
The fluxing section incorporates three pairs of rollers. A set of silicone input rollers provide positive drive for panels as they enter a pair of 76 mm (3") neoprene flux application rollers which are fed from an overhead manifold and a trough below.
A pair of silicone exit rollers remove excess flux, thus ensuring only a thin, even coating of flux remains over both surfaces of the panel. Conventional technology demands thick deposits of flux to ensure that some volatiles remain after aggressive I.R. pre-heating.
The presence of volatiles is essential in conventional systems to assist in the dynamics of wetting when the panel enters the leveling zone. Alchemy technology requires only a thin film of flux, thus reducing consumption by up to 75%.
2. Solder coating module
Panels are transported horizontally between two upper and lower solder manifolds. They then pass through oil coating rollers prior to entering the air knife section.
3. Air leveling section and exit table
Panels enter between the air knives, guided by the oil coating rollers on the entry side and supported on an air bearing table on the exit side. The air jets are angled to assist forward motion when the panel disengages from the entry rollers, and the fan is adjustable to suit panel size and mass.
The system includes the following features, which distinguish Alchemy from all other systems:-
a) Solder knife entry (flux displacement manifolds)
In the Alchemy system, flux displacement manifolds are mounted above the solder bath surface, and flux is removed from the solder mask 'wells' by oxide-free, high velocity solder.
This patented mechanism negates the need for volatiles or high acid content within the flux.
In this way all features are wetted immediately on entry and intermetallic growth will be uniform from site to site, unlike conventional technology where wetting may take place anywhere between entry and exit.
Conventional technology employs submerged flood manifolds below the solder level. This technique cannot provide sufficient velocity to displace the flux trapped in small 'wells' created by the solder mask, without the addition of volatiles (normally water).
While the use of volatiles is effective in displacing entrapped flux in 'vertical' leveling systems (when pre-heating is not employed), horizontal leveling demands that the substrate should be pre-heated above the boiling point of all suitable volatiles.
Pre-heating will drive off a sufficient proportion of the volatiles to severely inhibit their capability to displace trapped fluxes. In conventional systems this results in non-wetting of difficult surface features. The Alchemy flux displacement manifolds overcome this problem.
b) Precision roller transport
Panel speed through the solder pot and airknife section can be adjusted from 6 to 30 metres (20 to 100 ft.) per minute.
Panels are conveyed via multiple pairs of adjustable-pitch parallel rollers that provide smooth, positive transportation through the solder pot and air knife section, essential when processing panels at 45o.
The precise 'gap' adjustment of the parallel rollers negates the need to tape the panel edges to prevent material damage, particularly to fiducials and isolated conductors that tend to plate more thickly. The parallel rollers also ensure solder does not 'flood' against the air stream from the knives when exiting, allowing lower knife pressures to be employed to obtain thicker coatings when required.
c) Expansion chambers
Expansion chambers are provided for each airknife to prevent the expanding hot gas from the knives creating backpressure against the nozzles. This reduces the incidence of solder tails, random blocked holes and other re-deposition defects, and allows lower knife pressures to be used. The upper expansion chamber incorporates an oil/air separation system, which returns airborne oil to the sump.
d) Patented oil flushing system
A re-circulating oil system is employed to deliver heated, oxide-absorbing leveling fluid to manifolds sited above the rollers and solder manifolds. This prevents carbon build-up on the rollers and oxidisation of the solder. During the leveling cycle, oil washes down the solder balls, absorbing their oxide coating and evenly distributing the spent flux residues. Panels leave the solder pot through an oil application zone, which uniformly coats the surface with the essential leveling fluid immediately prior to the airknives.
e) Unique solder re-circulation system
Solder is delivered to the 'flux displacement' manifolds from a remote sump, and returns to the pump zone. In this way all contaminants that might otherwise be embedded into the panel surface are continually flushed away from the coating area.
f) Environmental containment
The primary exhaust duct is mounted above the roller/sump assembly's sliding containment cover. This in turn is enclosed by a secondary exhaust duct, which serves to cool the primary duct (thereby condensing oil from the air stream) and evacuates the area enclosed by the outer covers.
When the containment cover is withdrawn for maintenance access, both exhaust systems are employed to prevent fumes escaping into the surrounding environment. The solder pump and oil re-circulating tanks are accessed via the sliding rear covers.
g) Air knives
The airknives are designed to ensure stable nozzle pressures when operating against a variable resistance, as is the case with 45o processing. The quickly removable nozzles are available with differing profiles for different product technology and non-leaded alloys. The knives incorporate high efficiency heat exchangers enabling the air temperature to be maintained to within a few degrees, even at the highest operating speeds.
The upper airknife assembly hinges to permit rapid access to the upper and lower nozzles for cleaning. Both the upper and lower complete airknife assemblies can be removed from the machine in a short time, aided by quick-release electrical and air connections.
Adjustment of gap and offset between nozzles is motorised and can be set via the touch screen or automatically entered from established data.
Nozzle pressures are monitored and continually adjusted by electronically controlled regulators. Pressure settings are made and displayed at the 'view' screen.
h) Serviceability
All soldering machines need scheduled maintenance to ensure first pass yields and minimal down time. Considerable attention and twenty years of experience has been embodied within this latest 'Alchemy' design.
The following is an example of the serviceability and flexibility built into the 'Alchemy' leveler:-
Covers slide or lift completely clear of the machine, permitting unrestricted access. Provision is made for efficient extraction of fumes while working on the machine with covers removed.
All major electrical and air interconnects are plug and socket or quick-release.
The airknife nozzles can be simply and rapidly cleaned or removed.
The 3 pairs of transport rollers can be removed individually, as can the flux displacement manifolds.
The solder pump is attached to its manifolds by a quick-release mechanism.
The design of the leveler allows easy access to the solder sump for removing and replacing solder.
The oil circulation and flushing system virtually eliminates formation of dross and reduces cleaning within the solder pot area to a minimum.
PANEL EXIT/ ALIGNMENT
As solder coated panels leave the airknives they are transported onto an air support table. A guide arm (adjustable via the computer control system) directs the panels towards a stop gate where it is held and re-aligned.. As soon as the panel is below approx. 180 C deg (356 F deg) the stop gate is lowered and the panel is transported onto the following conveyor by means of a lower (driven) support roller and overhead air knife, which applies a downward pressure pushing the panel onto the roller.
CONVEYOR /COOLING MODULE (Drg Ref. 10)
Required when thicker product is being processed, this module reduces the panel temperature to below glass transition temperature to minimise warp and twist. It incorporates upper and lower air manifolds, providing balanced forced air cooling to both faces of the panel. Note: A conveyor section is supplied as standard unless the cooling module option is incorporated.
SECTION 3 POST TREATMENT (Drawing Ref. 11-16,19 & 23)
NOTE: The post-clean conveyor speed is adjustable via the touch screen. Nominal conveyor speed is 3.50 metres (11.5 ft.) per minute. Post-clean heat up time from ambient - approx. 1 hour. Mains water feed to final wash required at approx. 9.11-18.22 litres (2.0-4.0 imperial gallons) of reverse osmosis water per minute.
PRE-WASH NEUTRALISER (Drg Ref. 11)
The process assists the performance of the flux removal system to meet exacting surface insulation resistance (S.I.R) and ionic contamination (I.C) specifications. The unit applies a thin coat of flux neutraliser, negating the need to dose wash tanks with detergent. The application rollers are located within the composite Wash/Brush section Drawing Ref 12.
HOT WASH/BRUSH/WASH MODULE (Drg Ref. 12)
A composite wash and brushing section within one module. The chamber is heated to provide a warm water wash fed with fresh water from the following module. Squeegee rollers at module entry and exit points ensure minimal solution losses.
Shell Construction
: PVC.
Overall Machine Dimensions : Length: 1169mm (46"), Width: 1045mm (41"), Height:
1190mm (47")
FOUR STAGE CASCADE HOT WASH (Drg Ref. 13)
A multi-stage washing section based on 4 chambers contained within one module. The first three chamber are heated to provide a warm water wash fed with fresh water from the third chamber. The fourth chamber is a closed recirculating DI water wash. Squeegee rollers between each chamber and at module entry and exit points ensure minimal solution losses.
Shell Construction : PVC
Overall Machine Dimensions : Length: 1169mm (46"), Width: 1045mm (41"), Height:
1190mm (47")
TWO STAGE WASH / DI WASH (Drg Ref. 23)
A two-stage final wash section. The first wash chamber incorporates the incoming water supply, which is then pumped to the preceding module. The second chamber is a closed recirculating DI water wash.
Shell Construction
: PVC.
Overall Machine Dimensions : Length: 673mm (25.5")
Width: 1045mm (41"), Height: 1190mm (47")
DRYER (Drawing Ref. 14)
An air knife unit designed to remove water from panel surfaces and holes. It incorporates patented angled airknives delivering a high velocity air-stream to the panel via a variable speed blower unit.
Shell Construction
: PVC
Overall Machine Dimensions (mm) : Length: 485, Width: 1,175, Nominal Height:
1,230
Conveyor Dimensions (mm) : Nom. width:
760, Effective width: 635, Height: 920 - 980
Air Knives
: 1 upper, 1 lower Aerotip patented fluid airknives
Air Blower
: 5.6 kW variable speed
Drain Connection
: 25 mm O/D
FULL LENGTH EXIT CONVEYOR (Drg Ref. 15)
A slip wheel conveyor providing 'pick-up' area for panels.
Length
: 915mm (36")
Width
: 940mm (37")
Conveyor Width : Nominal: 760mm (30"),
Effective: 635mm (25")
Drainage Connection : Nominal: 40mm
65 PANEL FLAT BELT UNLOADER (OPTIONAL) (Drg Ref. 16)
A 65 panel fan-type unloader with software controlled indexing providing one or two step index option. Panel thickness capability - 0.40 mm to 3.18 mm nominal (0.016" to 0.125" nominal) depending on panel size and rigidity (minimum thickness will be greater for larger, less rigid panels).
CONTROL FEATURES
The Alchemy and Pre-heat control cabinet control the pre and post treatment sections of the system. The controls incorporate a touch screen to permit independent operation and adjustment.
The touch screen allows adjustment of all process variables and component settings, with three levels of password protection.
The solder heat-up sequence is software controlled to minimise thermal stresses and peak power demand, commensurate with minimum heat-up time.
Rinse water valves close when not processing panels.
Conveyors and pumps shut down when not processing panels.
Pumps cut in automatically to maintain constant temperature during idle mode.
After a user-specified time interval, the system will automatically switch to standby mode if no panels are processed. In this mode the solder temperature set-point is reduced and all air and pre-heat elements are isolated. The standby to run time interval is approx. 20 minutes.
To ensure jam detection and fail-safe shut down, panels are tracked during processing. Should a panel jam at any position, the preceding processes will shut down until the system is reset.
Solder and fluid levels are monitored, and warning is given of low levels. If any levels reach a dangerous low, the system will shut down, and level correction will be necessary before re-setting is possible. Full over and under set point temperature protection is provided.
OPTIONAL FEATURES
PERFORMANCE SPECIFICATION (Metric)
A. PANEL SIZE
Minimum :
270 mm diagonal (i.e. 230 x 152 mm) dependent on panel stability
Maximum : 610
x 762 mm
Will process 458 x 610 mm and smaller at a 45o angle.
For panels larger than 458 x 610 x less than 0.8mm thick, the degree of angling
is subject to panel rigidity. It may be necessary to process at 90 degrees to
the air knife.
B. PANEL THICKNESS
Mechanical adjustment from 0.5 mm - 5.00 mm (up to 6.35 is also available)
Loaders, unloaders and buffers/accumulators capable of handling panels with
nominal thickness of 0.50 - 4.00 mm.
C. NOISE LEVELS:
Less than 85 decibels as an 8 hours time-weighted average.D. PRE-CLEAN
E. POST-CLEAN
F. SYSTEM START-UP
System start-up time (from cold start): approx. 2 hours.
2. SYSTEM CAPABILITY
Note: The data below is offered in good faith and may be considered typical. However, solder thickness and uniformity is affected by copper thickness, type, surface topography and other variables. When processing panels that have a peelable mask, it is necessary to apply a suitable tape to the periphery of the panel. Cemco recommend testing of your product to determine capability.
1. SURFACE MOUNT PADS:
a. All measurements to be taken at the geometric centre of the pad.
b. All measured product to be run at 45o angle.
c. 0.5 mm pitch: 2.5 micron minimum, 25 micron maximum, 5 - 10 micron average
d. 0.625 mm pitch: 2.5 micron minimum, 25 micron maximum, 5 - 10 micron average
e. 1.1 mm pitch: 2 micron minimum, 25 micron maximum, 2.5 - 10 micron average
f. Discrete pads (1.78 mm x 3.05 mm and smaller): 1.5 micron minimum, 25 micron maximum, 2 - 7.5 micron average
B. MAXIMUM HOLE SIZE REDUCTION FOR PLATED THROUGH HOLES
a. 0.076 mm maximum hole size reduction.
b. Less than 0.051 mm average hole size reduction.
c. * Holes drilled smaller than 0.20 mm may plug with solder (for panels up to 1.6 mm thick).
For panels thicker than 1.6 mm, holes with aspect ratios larger than 8:1 may plug with solder.* Holes can be cleared accepting lower minimum thickness’. Holes must be free of any contamination.
Note A/B above
Assuming 0.5 mm pitch is targeted, other features may exhibit a thickness range outside that stated above. This may be true of other features/holes depending on size targeted.
C. FIRST PASS YIELD:
up to 97.0% measured on a weekly basis (Copper wetting 100% if copper is contaminant free)D. FINAL YIELD:
up to 99.90% measured on a weekly basisNote: A-E above is based on data supplied by existing users of Cemco systems.
F. SURFACE INSULATION RESISTANCE:
* Results dependent upon cleanliness of panel when introduced to HASL process; suitable chemistries, water supply, hot water and Pre-wash Neutraliser option, and cannot be guaranteed with other vendor equipment.
G. THROUGHPUT:
Up to estimated 300 panels per hour, of standard 458mm x 610 mm x 1.6 mm thick (weight and layer count dependent).
Larger and thicker panels may process slower. Depending on the mass and thickness of the panel it may be necessary to add an extra Pre-Heat and Post Treatment Drying module in order to process at the slowest speed specified. Cemco recommend testing of your product to determine capability.
Data assumes the required setting parameters have been established.
Note C-G above
References relate to panels processed with SnPb. Experience indicates that lead free processing is capable of producing thicker minimum deposits and a tighter minimum /maximum variance.
H. CONSUMABLE MATERIAL USE:
Solder: Typically 20% less than SnPb.
Flux: 11-25 M2/Litre. (Weight testing indicates 11, field experience with a wide range of product type has peaked at 20-25).
Oil: For guidance purposes the oil requires changing after three-six shifts or 24-48 hours whichever is the sooner. 30-40 Litres per change excluding periodic top-ups during normal production caused by extraction and drag-out.
Data provided assumes ' typical' product mix based on the majority of panels processed being 458 x 610 mm, 1.6 mm thick. An atypical product mix (e.g.: larger, thicker panels with low aspect ratio holes, slots or 'V' scored grooves) will increase flux usage.
I. SOLDER ANALYSIS
Copper: Dependent on alloy used.
Tin: Dependent on alloy used.
J. HIGH WEAR AND CONSUMABLE PART USAGE
Estimated at £15,000 Per Annum.
Please note:
All performance data relates to a complete system, cleaned, maintained,
serviced and operated to Cemco's recommendations, using approved chemicals and
materials. No data is available on "hybrid" systems at this time, but providing
the 'hybrid' system integration functions correctly and the processes are
compatible we believe the data is still valid.
The specifications described are subject to ongoing development and are subject to change without notice.
PERFORMANCE SPECIFICATION (Imperial)
A. PANEL SIZE
Minimum : 10.5" diagonal (i.e. 9" x
6") dependant on panel stability.
Maximum : 24" x 30"
Will process 18" x 24" and less at a 45 degree angle.
For panels larger than 18" x 24" x less than 0.030" thick, the degree of angling
is subject to panel rigidity. It may be necessary to process at 90 degrees to
the air knife.
B. PANEL THICKNESS
Mechanical adjustment from .020" - .200" (up to 250" is available).
Loaders, unloaders and buffers/accumulators capable of handling panels with
nominal thickness of 0.020" to 0.157".
C. NOISE LEVELS:
Less than 85 decibels as an 8 hours time-weighted average.D. PRE-CLEAN
E. POST-CLEAN
F. SYSTEM START-UP
System start-up time (from cold start): Approx. 2 hours.
2. SYSTEM CAPABILITY
Note: The data below is offered in good faith and may be considered typical. However, solder thickness and uniformity is affected by copper thickness, type, surface topography and other variables. When processing panels that have a peelable mask, it is necessary to apply a suitable tape to the periphery of the panel. Cemco recommend testing of your product to determine capability.
A. SOLDER THICKNESS
1. SURFACE MOUNT PADS:
a. All measurements to be taken at the geometric centre of the pad.
b. All measured product to be run at 45o angle.
c. 20 mil pitch: 100 microinch minimum, 1000 microinch maximum, 200 to 400 microinch average
d. 25 mil pitch: 100 microinch minimum, 1000 microinch maximum, 200 to 400 microinch average
e. 50 mil pitch: 80 microinch minimum, 1000 microinch maximum, 100 to 400 microinch average
f. Discrete pads (0.070" x 0.120" and smaller): 60 microinch minimum, 1000 microinch maximum, 80 to 300 microinch average
B. MAXIMUM HOLE SIZE REDUCTION FOR PLATED THROUGH HOLES
a. 0.003" maximum hole size reduction.
b. Less than 0.002" average hole size reduction.
c. * Holes drilled smaller than 0.008" may plug with solder (for panels up to 0.062" thick). For panels thicker than .062" thick, holes with aspect ratios larger than 8:1 may plug with solder.
* Holes can be cleared accepting lower minimum thickness’. Holes must be free of any contamination.
Note A/B above
Assuming 0.5 mm pitch is targeted, other features may exhibit a thickness range outside that stated above. This may be true of other features/holes depending on size targeted.
C. FIRST PASS YIELD:
up to 97.0% measured on a weekly basis. (Copper wetting 100% if copper is contaminant free)D. FINAL YIELD:
up to 99.90% measured on a weekly basis.E. MAINTENANCE:
Total up time 96%Note: A-E above is based on data supplied by existing users of Cemco systems.
F. SURFACE INSULATION RESISTANCE:
* Results dependent upon cleanliness of panel when introduced to HASL process; suitable chemistries, water supply, hot water and Pre-wash Neutraliser option, and cannot be guaranteed with other vendor equipment.
G. THROUGHPUT:
Up to estimated 300 panels per hour, of standard 18" x 24" x 0.062" thick, (weight and layer count dependent).
Larger and thicker panels may process slower. Depending on the mass and thickness of the panel it may be necessary to add an extra Pre-Heat and Post Treatment Drying module in order to process at the slowest speed specified. Cemco recommend testing of your product to determine capability.
Data assumes the required setting parameters have been established.
Note C-G above
References relate to panels processed with SnPb. Experience indicates that lead free processing is capable of producing thicker minimum deposits and a tighter minimum /maximum variance.
H. CONSUMABLE MATERIAL USE:
Solder: Typically 20% less than SnPb.
Flux: 545 – 1,227 Ft2/Imperial gallon (Weight testing indicates 545, field experience with a wide range of product type has peaked at 1,000 – 1,227).
Oil: For guidance purposes the oil requires changing after three-six shifts or 24-48 hours whichever is the sooner. 6.6 –8.8 imp gallons Litres per change excluding periodic top-ups during normal production caused by extraction and drag-out.
Data provided assumes 'typical' product mix based on the majority of panels processed being 24"x18", 0.062" thick. An atypical product mix (eg: larger, thicker panels with low aspect ratio holes, slots or 'V' scored grooves) will increase flux usage.
I. SOLDER ANALYSIS
Copper: Dependent on alloy used.
Tin: Dependent on alloy used.
J. HIGH WEAR AND CONSUMABLE PART USAGE
Estimated at £15,000 Per Annum.
Please note:
All performance data relates to a complete system, cleaned, maintained, serviced and operated to Cemco's recommendations using approved chemicals and materials. No data is available on hybrid systems at this time, but providing the 'hybrid' system integration functions correctly and the processes are compatible we believe the data is still valid.
The specifications described are subject to ongoing development and are subject to change without notice.
ALCHEMY 'D' TYPE INSTALLATION DATA
Leveler:
Max height (top of hood extraction duct) 2420 mm (95.3")
Max width 2250 mm (88.6")
Depth (front door to rear door) 2020 mm (79.5")
Gross weight (including solder) 2,200 kg (4,840 lbs)
Solder fill 350 Kg approx. (770 lbs approx.)
Extraction
: Duct Size/Extraction RateLeveling section
Note:
1) Damper control required on all exhausts.
2) All connecting extract ducts to be 316 grade stainless steel.
3) Suction head can be worked out using diameter of duct and volume of flow through duct.
Pre-Treatment:
Chemical cleaner/Acid Rinse 3 off 38mm dia (1.5" dia)
Exhaust flow requirement 3 off 1.85 M
Pre-heat:
101.6mm (4")
Post-Treatment:
Conveyors:
Infeed (pre-heat) height 1000mm (39.5")
Outfeed (air table) height 965mm (38")
Electrical cabinet:
Alchemy:
Cabinet height 1448mm (57")
Cabinet length 1702mm (67")
Cabinet depth 660mm (26")
Pre & Post –Treatment x 2:
Cabinet height 1524mm (60")
Cabinet length 1257mm (49.5")
Cabinet depth 660mm (26")
Power requirement:
Pre-Treatment 63 amp supply, Peak 35A per phase. Nominal 30A per phase 25 kva
Alchemy ‘D’
including 2 x Pre-Heat modules 160 amp supply, Peak 155A per phase. Nominal 135A per phase 112 kva.1 x Additional Pre-heat 63 amp supply. Peak 40A per phase. Nominal 35A per phase. 28 kva
Post-Treatment 120 amp supply, Peak 105A per phase 87 kva. Nominal 70A per Phase 58kva
Heat Load around preheats and Alchemy 5-10 deg C (41-50 deg F) to be confirmed
Air supply:
Compressed air 3,920 Ltrs (140 cu/ft) per minute) @ 7.0 Bar (100 psi).
Minimum air receiver requirement 1,350 ltrs (48 cu/ft) @ 7.1 Bar (100psi)
Air quality required ISO/DIS 8573.1 class 4.6.4.
Air connection 2" BSP.
Air input location On main rear frame of Align/rotate module.
Air input height from floor 650mm approx. (27" approx.)
Chemistry:
Enthone HO 2508 oil, HF 2509 flux. R&H Even Flow oil 1224, and Even Flow flux 1205.Mascon Polaris 0-300 EL oil, and F-200 EL flux.