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Custom Engineering Examples: Reel to Reel Plating system:
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| Cemco were approached by
Conductive Inkject Technology
in Cambridge to design a
reel to reel electroless plating machine for RFID antennas. RFID is an
automatic identification method, relying on storing and remotely
retrieving data using devices called RFID tags transponders. The
technology requires some extent of cooperation of an RFID reader and an
RFID tag. An RFID tag is an object that can be applied to or
incorporated into a product, animal, or person for the purpose of
identification and tracking using radio waves. Some tags can be read
from several meters away and beyond the line of sight of the reader.
For more information on RFID technology visit
http://www.rfidc.com It took Cemco less than 6 months to design and build a roll to roll electroless plating system to CIT's demanding requirements, providing the second stage of CIT's world first roll to roll production line utilizing CIT's proprietary inkjet technology for building truly additive pure copper RFID antennas and other thin copper flexible circuitry. The METALJET 6000 system begins with inkjet printing thin flexible substrates with a UV curable catalytic ink in a digital process that supports rapid design changeover. After curing the Cemco Electroless Plating System creates the exceptional uniform solid copper patterns. Several Cemco patented techniques are incorporated, adaptations of those used in the new Cemco Streamline Range of PCB wet processing systems that have proven to result in faster reaction times and improved uniformity compared with conventional equipment. These include a non-contact transport system that floats the 60 meters of immersed web through the 2 meter long serpentine sump at speeds of up to 12 meters per min. with less than 800 grams of tension and 'fluid knifes' that provide high speed contactless rinsing, surface treatment and drying. The system also incorporates unwinding and rewinding devices and a fully integrated PLC control system with touch screen, HMI data logging and fault analysis that automatically adjusts the mechanical and chemical process to match the circuit pattern area and thickness requirements as well as managing automatic tank servicing, chemical transfer and storage routines.
For more information to go: http://www.pcb007.com/pages/zone.cgi?a=46386
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