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Lead Free Solder Comparisons

 

 

Sn-3.5Ag

Sn-Ag-Cu

Sn-Ag-Cu-Sb

Sn-0.7Cu

Sn-Bi-Ag

Sn-Zn-Bi

Melting/process temperature

5

3.5

3.5

6

2

1

Fillet lifting resistance(1)

2.5

2.5

2.5

2.5

5.5

5.5

Solderability(2)

4

2

3

5

1

*10

Processability(3)

3

1.5

1.5

5

4

*10

Reliability(4)

3

1.5

1.5

4

5

6

Recyclability(5)

2.5

2.5

2.5

2.5

5

6

             

Cost(6)

4.5

4.5

4.5

1.5

4.5

1.5

Alloy availability(7)

1.5

3

4

1.5

5

6

             

TOTAL SCORE

26

21

23

28

32

46

AVERAGE SCORE

3.3

2.6

2.9

3.5

4.0

5.6

                            Proposed range                          Typical Comp.

                                    3.4 – 4.1 % Ag                                    2.5 Ag
                          plus                                                        0.8Cu
                            0.45 - 0.9 % Cu                                    0.5Sb

1 GOOD- 6 POOR- 10 BAD

 

NOTES:

  1. Bi alloys most prone to fillet lift, and most problems with Pb contamination

  2. Zn alloy oxidation, requires very strong flux

  3. SnAgCu(Sb) and SnBiAg advantage of lower temperature, but with SnBiAg must consider fillet lifting

  4. On average only; different/best service conditions can give different ranking

  5. Zn and Bi increase problems/cost; some pros and cons for all other alloys

  6. Approximate relative cost: dependent on Ag content: more effect on bar than paste

  7. SnAgCu some patents; SnAgCuSb patented and licensed; SnBiAg and SnZnBi various patents

 

Alchemy ‘C’ Tin-Copper Trial Report

 

Date:  20th & 21st January 1999

Location:  Quicksilver Services in Galashiels (Cemco HASL Service Centre)

Purpose:  To determine Alchemy capability when using a 'Lead-Free' solder alloy of Sn 99.3% + Cu 0.7%.  To experiment with the process parameter settings to produce the best possible product quality when running a) Air, b) Nitrogen, through the air the knives to compare results.

Solder temperature 280C (536F)

Air Heat Exchanger 300C (572F)

Air Knives 275C (527F)

The increased solder temperature (with SnPb the temperature would typically be 250C/482F) had the effect of raising the oil temp from a normal running of 230C (446F) to 255C (491F)

 

RUN PARAMETER DATA

Board Number

Board temp

Pre-Heat

(MPM)

Level Speed (MPM)

Bar Pressure

Top/Bot

Gap (mm)

Off Set (mm)

Board Type

1.6mm (0.062")

Gas Used

1

196

2.3

24

1/1.1

3.05

1.75

Non Drilled D/S

Air

2

228

1

24

1.1/1.2

3.05

1.75

D/S

Air

3

217

1

20

1.35/1.45

3.05

1.75

D/S

Air

3

212

1

20

1.35/1.45

3.05

1.75

6 layer Multilayer

Air

4

224

1

20

1.35/1.45

3.05

1.75

6 layer Multilayer

Air

5

227

1

20

1.2/1.3

3.05

1.75

6 layer Multilayer

Air

6

220

1.3

25

1.15/1.25

3.05

1.75

D/S

Air

7

220

1.3

24

1.15/1.3

3.2

1.75

D/S

Air

7b (3 off)

220

1.3

24

1.15/1.3

3.2

1.75

Drilled/Non Drilled D/S

Air

8

209

1.3

24

1.0/1.15

3.2

1.75

Rework Multilayer

Nitrogen

9

218

1.3

24

1.0/1.15

3.2

1.75

Rework Multilayer

Nitrogen

10

218

1.3

24

0.95/1.1

3.2

1.75

Rework D/S

Nitrogen

11

218

1.3

24

0.9/1.0

3.2

1.75

Rework D/S

Nitrogen

12

203

1.3

22

1.1/1.2

3.2

1.75

Rework Multilayer

Nitrogen

 

Note: Pre–heat speed based on using two Pre-heat modules. (MPM) meters per minute.