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ENTEK PLUS is one of the
worlds leading Organic Solderability Preservatives with over 350 major
OEM approvals and over 250 PCB fabricator installations world-wide. It
is a simple, easy to use, environmentally friendly process, providing
the most cost effective alternative to Hot Air Solder Levelling. The
coating can withstand over 4 heat excursions and has a shelf life of 12
months, and together with the benefits of flat pads and first pass yield
improvements makes ENTEK PLUS the choice for many assemblers.
Stage 1 : ENTEK Cleaner SC-1010DE. Three Stage Cascade Water
Wash.
This first stage removes light organic residues from the copper surface
to allow even activation of the micro etch.
The module used is a spray type process, operating at temperatures of 43
- 49C, utilising a series of top and bottom fixed spray bars. The
materials of construction are PVC and Titanium which are both chemically
resistant. Features of the module include pressure gauges, pump side
filtration and top and bottom spray trim valves.
Stage 2 : ENTEK Micro Etch ME-1020. Three Stage Cascade Water
Wash
The micro etch is specifically designed to provide the ideal
micro-roughened and active copper surface prior to coating with ENTEK
PLUS. This surface will enhance the bond and the uniformity of the ENTEK
PLUS coating.
The module used is a spray type process operating at temperatures of 21
- 25C, utilising a series of top and bottom fixed spray bars. The
materials of construction are PVC and Titanium which are both chemically
resistant. Features of the module
include pressure gauges, pump side filtration and top and bottom spray
trim valves.
Stage 3 : Sulphuric Acid Rinse, Two Stage Cascade Water Wash.
This stage of the process reactivates the copper surface and reduces any
copper oxide formation.
The module used is a small spray type processing unit operating at
ambient temperature. The unit is fitted with 2 or 3 spray bars. The
materials of construction are PVC and Titanium which are both chemically
resistant. Features of the module include, pressure gauges, pump
side filtration and top and bottom spray trim valves.
Stage 4 : ENTEK PLUS Cu-106A The organic coating bonds with the
copper in this stage and builds to a thickness of between 0.2 and 0.5.
Concentration, pH and temperature are optimised to produce the required
thickness, usually 0.3 to 0.4
The module used is a flood immersion process operating at temperatures
of 40 - 48C, utilizing a series of carefully designed immersed top and
bottom side through hole flood manifolds. The module allows the
requirement for minimal, and controllable, turbulence in the flood
chamber. This is assisted by a carefully engineered solution return and
re-distribution system with even solution dispersion across the flood
bars. This in turn gives an even coating thickness across the board.
FINAL STEPS
AIR KNIFE MODULE : This unit is fitted with 1 top and 1bottom mid
velocity air knife to remove any excess ENTEK PLUS Solution.
This is followed by a short inspection section.
TWO STAGE DI CASCADE WATER WASH & FINAL BOARD DRY: The final
board drying module has two main process areas. The
first section is fitted with 1 top and 1 bottom mid velocity air knifes
for through hole drying. This is followed by a warm air oven which
removes any reamining surface moisture.
- Alan Bradley Touch Screen and PLC Control System
- Chemical sampling points for easy analysis
- Pressure gauges fitted to all process steps to monitor the solution
flow
- Variable conveyor speed control for optimum processing
- Heating and cooling carefully balanced and linked to energy saving
circuits
- Re-circulating and automatic linked water rinsing systems for minimal
water usage
- Low maintenance vertical pumps facilitate removal without the need to
drain chemistry
- Optional online SPC (Statistical Process Control) package
- Optional auto loading and unloading equipment
Cemco and Enthrone offer a conveyorised OSP system combining
equipment and chemistry facilitating manufacture from start
to finish in 8 - 10 minutes. Cemco systems are perfectly tailored to
each process. The modular design and construction of all FSL equipment
ensures favourable cost/performance ratio and allows for the system to
be extended to suit increased capacity if ever the need arose.
Combining our many years of engineering experience in manufacturing wet
process modules with the latest processing techniques ensures that our
process systems operate at the highest performance levels delivering
optimum yields.
Cemco offer a full range modular process systems capable of
processing speeds from 0.4-6m per minute depending on the system
configuration required. |
